EFECS 2024

05/12/2024-06/12/2024

Thrilled to share that the REBECCA KDT JU project was brilliantly showcased at EFECS2024, the European Forum for Electronic Components and Systems!

This premier event brought together innovators and leaders to explore breakthroughs in electronic components, systems, and applications. The REBECCA KDT JU project team highlighted cutting-edge developments in RISC-V-based systems, chiplet technology, and specialised tools for safety and security, sparking engaging discussions and valuable insights.

Kudos to the team for their outstanding representation!

ACKNOWLEDGMENT: REBECCA project is supported by the Chips Joint Undertaking and its members, including the top-up funding by National Authorities under grant agreement n° 101097224. Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or the granting authority. Neither the European Union nor the granting authority can be held responsible for them.